Shaanxi Puwei Electronic Technology Co., Ltd. continues to strengthen its position in the electronic materials sector with its expanding range of Metalization Ceramics. The company offers substrates made from alumina, zirconia, and steatite ceramics, enhanced with surface metallization in silver, silver-palladium, molybdenum-manganese, or tungsten.
To ensure excellent solderability and electrical performance, these surfaces can be further electroplated with nickel, tin, or gold, making them ideal for high-reliability applications.
Puwei’s Metalization Ceramics are widely used in high-frequency chip inductors, miniature transformers, semiconductor module insulation, ceramic sealing, and precision mechanical components. Products can be tailored to meet specific technical and dimensional requirements, offering flexibility to customers in diverse industries.
For more details on product customization :DBC Ceramic Substrate, AMB Ceramic Substrate, and DPC Ceramic Substrate, please contact our sales team.