Shaanxi Puwei, established in 2017, specializes in advanced ceramic materials for power electronics. Our Direct Bonded Copper (DBC) ceramic substrates offer outstanding thermal cycling performance, supporting up to 50,000 cycles. The low thermal expansion coefficient, closely matched to silicon, ensures excellent reliability under harsh operating conditions.
Our DBC substrates combine pure copper with high-performance ceramics like Al₂O₃, ZTA, and Si₃N₄, creating a robust and thermally conductive interface. These metallized ceramics are ideal for applications requiring both electrical insulation and efficient heat dissipation.
Product Highlights:
1.Materials: Alumina (Al₂O₃), ZTA, Silicon Nitride (Si₃N₄)
2.Function: Electrical insulation, heat dissipation
3.Type: Metallized ceramic substrate
4.Customization: Available upon request – drawings required
5.Optional Material: AlN ceramic with thermal conductivity up to 230 W/m·K
Our AlN and Al₂O₃ ceramic products feature high thermal conductivity, low dielectric constant, minimal loss tangent, and excellent mechanical properties. These characteristics make them widely used in IGBT modules, high-power LEDs, optical communication, TECs, and other demanding fields.
Shipping & Delivery:
Global delivery via UPS, DHL, FedEx, and other major carriers.
Contact Us:
Looking for custom DBC ceramic substrates? Reach out with your specifications and let us help you find the best solution for your application.
Explore more:
We also supply DBC Ceramic Substrate, DPC Ceramic Substrate, and AMB Ceramic Substrate with full customization options.