AMB (Active Metal Brazing) technology is a significant advancement over traditional DBC techniques. By incorporating active elements such as Ti or Zr into the brazing alloy, a reactive layer forms between the ceramic and the metal, enabling a strong and reliable metallurgical bond. This method ensures improved thermal cycling performance and higher bonding strength, making it ideal for demanding power electronics applications.
Key Features:
- Materials: AlN, Al₂O₃, ZTA, Si₃N₄
- Functions: Electrical insulation and efficient thermal management
- Type: Metallized ceramic substrates
Product Description:
AMB ceramic substrates are designed to meet the high-performance requirements of power semiconductor modules. They provide mechanical support, electrical insulation, circuit interconnection, and heat dissipation channels for Si- or SiC-based power chips. These substrates are essential in managing the thermal and electrical stresses in high-power applications.
Shaanxi Puwei also provides customized solutions for clients requiring specialized substrate specifications. For further inquiries or tailored support, please feel free to contact us.
Explore our full range of advanced substrates:
AMB Silicon Nitride Ceramic Substrate | Si3N4 Ceramic AMB Substrate | Si3N4 Ceramic AMB Copper-clad Substrate | AMB Ceramic Substrate