Shaanxi Puwei Electronic Technology Co., Ltd. presents its advanced DPC Ceramic Substrate solutions, tailored for next-generation high-reliability electronic applications. Developed from thin-film ceramic circuit processing, DPC (Direct Plated Copper) substrates are fabricated using AlN or Al₂O₃ ceramics, combined with sputtering, electroplating, and photolithography to form precise and high-density circuit patterns.
DPC Ceramic Substrate Advantages
Application Fields
1.LED Ceramic Substrates
Used in high-brightness automotive and horticulture lighting, offering excellent thermal performance, insulation, and reliability.
2.Laser Diode (LD) Heat Sink Substrates
Based on AlN ceramic, these substrates are essential for high-power semiconductor lasers in fiber communication and optical systems.
3.Automotive LiDAR Substrates
High thermal conductivity, high flatness, and chip-matching expansion properties make these substrates key components in intelligent driving modules.
4.Thermoelectric Cooler (TEC) Substrates
Applied in optical communication, aerospace, and thermal management systems, offering strong insulation and mechanical durability.
Explore more about our advanced ceramic solutions:
Metallized Substrate For Thin Film Circuits | Dpc Substrate For Thin Film Circuits | Dpc Substrate For Ics | DPC Ceramic Substrate
For tailored support and substrate customization, please contact our technical team.