Shaanxi Puwei Electronic Technology Co., Ltd. proudly introduces its latest innovation—Insulated Metallized Baseplate (IMB), a cutting-edge ceramic substrate designed specifically for advanced IGBT module applications.
The IMB substrate features a composite structure combining oxygen-free copper circuits with a high-conductivity liquid crystal polymer insulation layer, achieving a thermal conductivity up to 10 W/m·K. With customizable circuit thickness (0.3–5.0 mm) and a base thickness of ≥2.0 mm, IMB meets the thermal and electrical demands of high-power-density modules.
Key Advantages:
- Enhanced thermal performance: 50% improvement in heat dissipation efficiency
- Higher isolation voltage: Reliable for high-voltage power applications
- Optimized packaging structure: Eliminates solder layers, improving thermal cycling durability and extending IGBT module lifespan
Applications:
Widely used in electric vehicles, industrial inverters, smart grid equipment, and other high-efficiency power electronic systems.
Learn more about our portfolio:
Metalization Ceramics/AMB Ceramic Substrate/DBC Ceramic Substrate/DPC Ceramic Substrate
