Direct Bonded Copper (DBC) ceramic substrates are a proven solution for electrical insulation and thermal management in high-power semiconductor applications. By bonding high-purity copper to ceramic at high temperatures, DBC substrates offer excellent heat dissipation, high current capacity, and long-term reliability.
With increasing demand for efficient power modules in industrial systems, electric vehicles, transportation, and consumer electronics, DBC substrates play a critical role in supporting the performance and durability of power devices.
At Shaanxi Puwei, we offer customizable DBC substrates using ceramic materials such as Alumina (Al₂O₃), ZTA, and Silicon Nitride (Si₃N₄), tailored to your specifications. All our ceramic substrates are designed for superior insulation, mechanical strength, and heat conductivity.
Product Highlights:
Materials: Al₂O₃ / ZTA / Si₃N₄
Type: Metallized Insulating Ceramics
Function: High thermal conductivity, electrical insulation
Customization: Available upon request with technical drawings
Founded in 2017, Shaanxi Puwei focuses on the R&D of ceramic-based materials. Our AlN and Al₂O₃ ceramics are known for high thermal performance, low dielectric constant, and excellent mechanical properties. Widely used in HELED, optical communication, IGBT, power electronics, and TEC systems, our substrates meet the demands of next-generation high-power applications.
Other Services:
DBC Ceramic Substrate
DPC Ceramic Substrate
AMB Ceramic Substrate
For custom solutions or technical consultation, please contact our team directly.