Ceramic substrates have become essential in high-power electronic systems, especially in power modules used in electric vehicles (EVs) and hybrid electric vehicles (HEVs). These modules demand compact circuit designs capable of handling high voltages and currents while maintaining excellent thermal management and electrical insulation.
To meet these requirements, ceramic substrates such as DBC (Direct Bonded Copper) and AMB (Active Metal Brazed) are widely adopted. These substrates consist of copper layers bonded to both sides of a ceramic base, combining the high electrical conductivity of copper with the superior thermal and dielectric properties of ceramics.
Our range of ceramic substrates includes:
1.Alumina (Al₂O₃)
Cost-effective with reliable performance
Moderate thermal conductivity
2.Aluminum Nitride (AlN)
High thermal conductivity (up to 170 W/m·K)
Excellent CTE match with silicon
High flexural strength
3.Silicon Nitride (Si₃N₄)
Outstanding mechanical strength and fracture toughness
Excellent thermal performance
These substrates are ideal for integrating IGBT and devices in power modules, providing the thermal efficiency and insulation needed for long-term operation. The close CTE match between the ceramic substrate, metal traces, and components also helps reduce thermal stress and improves reliability.
As a trusted China-based ceramic manufacturer, we are committed to delivering high-quality materials tailored for the power electronics industry. Our products are widely used in automotive, renewable energy, industrial control, and rail transit sectors.
Explore more:96 Alumina Ceramic Substrate/Si3N4 Ceramic Products/Aluminum Nitride Ceramics/Metalization Ceramics