Microporous ceramic vacuum chucks are widely used in semiconductor wafer processing, including thinning, shaping, dicing, grinding, and cleaning. Acting as precision worktables, these fixtures securely hold wafers in place throughout critical production steps.
The chuck surface is made of alumina ceramic, where a uniform porous or hollow structure is formed through high-temperature sintering. By applying negative pressure, the system generates stable vacuum suction to fix wafers and other components firmly in position.
The base and frame can be manufactured from aluminum alloy, stainless steel, or ceramic, depending on process requirements.
Key Advantages:
- High hardness and durability
- Fast heat dissipation
- Excellent wear resistance
- Strong acid and alkali corrosion resistance
- High flatness, parallelism, and uniform micropore distribution
- Smooth surface with reliable and even suction performance
In addition, non-standard designs can be customized to meet specific customer requirements, ensuring flexibility across various semiconductor applications.
For more information or customization options:Semiconductor Robotic Arm /Semiconductor Ceramic Robotic Arm /Wafer Handling Ceramic Arm